Signal Integrity Engineer
Huijing
Responsibilities:
Working closely with both RD and Application Engineering teams and responsible for defining and supporting IC-package-PCB power and signal integrity solution including product specification, technical marketing and carrying out customer evaluation and benchmark
Qualification:
Minimum 2 years (5 years for senior position.) SI hardware engineering experience
Proficiency with SPICE circuit simulation, field-solver and time/frequency domain analysis
Solid background in transmission line theory
Familiarity with high-performance I/O technologies such as LVDS, CML, HSTL
Familiarity with package and PCB power delivery network modeling
Experience with HSPICE, HFSS, PowerSI/SIwave, Paksi-E/TPA
Experience in correlating simulation results with lab measurement is a plus
Self motivation, teamwork and strong communication skills
M.S. or Ph.D. in Electrical Engineering or other related areas
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